Release chemical protection for integrated complementary metal-oxide-semiconductor (cmos) and micro-electro-mechanical (mems) devices

ABSTRACT

Systems and methods that protect CMOS layers from exposure to a release chemical are provided. The release chemical is utilized to release a micro-electro-mechanical (MEMS) device integrated with the CMOS wafer. Sidewalls of passivation openings created in a complementary metal-oxide-semiconductor (CMOS) wafer expose a dielectric layer of the CMOS wafer that can be damaged on contact with the release chemical. In one aspect, to protect the CMOS wafer and prevent exposure of the dielectric layer, the sidewalls of the passivation openings can be covered with a metal barrier layer that is resistant to the release chemical. Additionally or optionally, an insulating barrier layer can be deposited on the surface of the CMOS wafer to protect a passivation layer from exposure to the release chemical.

CROSS REFERENCE TO RELATED APPLICATION

This application is a divisional of, and claims priority to, U.S. patentapplication Ser. No. 14/477,451, entitled “RELEASE CHEMICAL PROTECTIONFOR INTEGRATED COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) ANDMICRO-ELECTRO-MECHANICAL (MEMS) DEVICES,” filed on Sep. 4, 2014. Theentirety of the above-referenced U.S. patent application is herebyincorporated herein by reference.

TECHNICAL FIELD

The subject disclosure relates to integrated complementarymetal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS)devices, e.g., to release chemical protection for the integratedCMOS-MEMS devices.

BACKGROUND

Micro-Electro-Mechanical Systems (MEMS) is a widely used technology thatenables integration of both microelectronic circuits and mechanicalstructures on the same chip, while significantly lowering fabricationcosts and chip size. Oftentimes, a surface micromachining technique isutilized to fabricate MEMS devices, wherein structural parts of thedevice are combined with layers of a sacrificial material. Thesacrificial material is then removed by employing a chemical etchantthat does not react with the structural material, leaving behind movablestructural parts. Typically, MEMS processes using sacrificial oxides arewell suited to produce fragile structures such as thin membranes or lowstiffness mechanical devices by mechanically supporting such devicesduring the fabrication process and releasing the sacrificial layers as alast step in the process. The most widely used surface micromachiningtechniques use Silicon dioxide (SiO₂) as the sacrificial materialHydrofluoric acid (HF) as the chemical etchant.

For MEMS structures that are integrated with a CMOS wafer, the CMOSwafer is susceptible to damage due to the exposure to the hydrofluoricacid (HF) based chemical etchant during MEMS release. Moreover, aconventional CMOS wafer contains silicon oxide in its inter-metaldielectrics and passivation stack, which etches rapidly on exposure toHF. Specifically, passivation openings on the CMOS wafer that areutilized to expose metal pads for bonding the CMOS wafer to the MEMSstructure, expose the wafer's silicon oxide, making the wafer unsuitablefor HF exposure during fabrication of integrated CMOS-MEMS devices.

SUMMARY

The following presents a simplified summary of the specification toprovide a basic understanding of some aspects of the specification. Thissummary is not an extensive overview of the specification. It isintended to neither identify key or critical elements of thespecification nor delineate any scope particular to any embodiments ofthe specification, or any scope of the claims. Its sole purpose is topresent some concepts of the specification in a simplified form as aprelude to the more detailed description that is presented later.

The systems and methods described herein, in one or more embodimentsthereof, relate to an integrated complementary metal-oxide-semiconductor(CMOS) and micro-electro-mechanical (MEMS) device that prevents damageto the CMOS layers during the release of the MEMS structure. In oneaspect, the system relates to an integrated circuit substrate (e.g.,CMOS layers) comprising a passivation opening having a sidewall thatexposes a dielectric layer of the integrated circuit substrate. Further,a metallic barrier layer is deposited on the sidewall that prohibitsexposure of the dielectric layer to a release chemical employable torelease the MEMS structure integrated with the integrated circuitsubstrate.

An aspect of the disclosed subject matter relates to a method thatcomprises creating an opening in a passivation layer of an integratedcircuit substrate, wherein a sidewall of the opening exposes adielectric layer of the integrated circuit substrate. Further, themethod comprises depositing a metal layer on the sidewall to protect thedielectric layer from a release chemical employable to release a MEMSdevice integrated with the integrated circuit substrate. Further, yetanother aspect of the disclosed subject matter relates to an integratedCMOS-MEMS device comprising a CMOS wafer and a MEMS device that isintegrated with the CMOS wafer. Moreover, the MEMS device comprises asacrificial layer that is removable by utilization of a releasechemical. Further, the CMOS wafer comprises a passivation layer with anopening having a sidewall that exposes a dielectric layer of the CMOSwafer and a barrier material comprising a metal resistant to the releasechemical that covers the sidewall.

The following description and the annexed drawings set forth certainillustrative aspects of the specification. These aspects are indicative,however, of but a few of the various ways in which the principles of thespecification may be employed. Other advantages and novel features ofthe specification will become apparent from the following detaileddescription of the specification when considered in conjunction with thedrawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The numerous aspects, embodiments, objects and advantages of the presentinvention will be apparent upon consideration of the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich like reference characters refer to like parts throughout, and inwhich:

FIG. 1 illustrates example complementary metal-oxide-semiconductor(CMOS) wafer that is resistant to a release chemical;

FIG. 2 illustrates an example CMOS wafer comprising a passivation layerthat is protected from exposure to a release chemical;

FIGS. 3A and 3B illustrate an example integrated CMOS andmicro-electro-mechanical (MEMS) device during different stages offabrication;

FIGS. 4A and 4B illustrate an example MEMS structure integrated within ametallization stack of a CMOS device during different stages offabrication;

FIG. 5 illustrates an example system utilized for sensing an acousticsignal;

FIG. 6 illustrates an example methodology for depositing protectivelayers within an integrated CMOS-MEMS device; and

FIG. 7 illustrates an example methodology for protecting a dielectriclayer of an integrated CMOS-MEMS device.

DETAILED DESCRIPTION OF THE INVENTION

One or more embodiments are now described with reference to thedrawings, wherein like reference numerals are used to refer to likeelements throughout. In the following description, for purposes ofexplanation, numerous specific details are set forth in order to providea thorough understanding of the various embodiments. It may be evident,however, that the various embodiments can be practiced without thesespecific details, e.g., without applying to any particular networkedenvironment or standard. In other instances, well-known structures anddevices are shown in block diagram form in order to facilitatedescribing the embodiments in additional detail.

Systems and methods disclosed herein, in one or more aspects providerelease chemical protection for integrated complementarymetal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS)devices. The subject matter is described with reference to the drawings,wherein like reference numerals are used to refer to like elementsthroughout. In the following description, for purposes of explanation,numerous specific details are set forth in order to provide a thoroughunderstanding of the subject innovation. However, that the subjectmatter may be practiced without these specific details.

As used in this application, the term “or” is intended to mean aninclusive “or” rather than an exclusive “or”. That is, unless specifiedotherwise, or clear from context, “X employs A or B” is intended to meanany of the natural inclusive permutations. That is, if X employs A; Xemploys B; or X employs both A and B, then “X employs A or B” issatisfied under any of the foregoing instances. In addition, thearticles “a” and “an” as used in this application and the appendedclaims should generally be construed to mean “one or more” unlessspecified otherwise or clear from context to be directed to a singularform. In addition, the word “coupled” is used herein to mean direct orindirect electrical or mechanical coupling. In addition, the words“example” and/or “exemplary” are used herein to mean serving as anexample, instance, or illustration. Any aspect or design describedherein as “example” and/or “exemplary” is not necessarily to beconstrued as preferred or advantageous over other aspects or designs.Rather, use of the word exemplary is intended to present concepts in aconcrete fashion.

Initially, referring to FIG. 1, there illustrated is an examplecomplementary metal-oxide-semiconductor (CMOS) wafer 100 that isresistant to a release chemical. In one example, the CMOS wafer 100 canbe utilized for various applications, such as but not limited to, audiosensors, wireless devices, industrial systems, automotive systems,robotics, telecommunications, security, medical devices, etc. Typically,the CMOS wafer 100 comprises a substrate 102, a dielectric layer 104(e.g., silicon oxide (SiO₂)), a passivation layer 106 (e.g., SiliconNitride), and metal pads 108. As an example, the passivation layer 106comprises thin-film coatings (e.g., of Silicon Nitride) that can bedeposited on the layers of the CMOS wafer 100 using plasma enhancedchemical vapor deposition (PECVD). The passivation layer 106 protectsthe CMOS layers from moisture and/or external contamination, enablesheat dissipation, increases wear resistance and/or increases electricalinsulation. Oftentimes, passivation openings (110 a, 110 b) are createdwithin the passivation layer 106, for example, to expose the metal pads108 for bonding to a micro-electro-mechanical (MEMS) device (not shown)via eutectic bonds, metal compression bonds, fusion bonds, anodic bonds,copper-to-copper bonds, etc. In another example, passivation openings(110 a, 110 b) can be created within the passivation layer 106 to exposea wire-bond pad to facilitate packaging the CMOS wafer 100 and/or toexpose probe pads. The dielectric layer 104 is exposed through sidewalls(vertical façade) 112 of the passivation openings (110 a, 110 b). If theCMOS wafer 100 is exposed to a release chemical (e.g., Hydrofluoricacid) utilized for a release etch of MEMS structures from sacrificiallayer (not shown), the release chemical can react with the dielectriclayer 104, leading to substantial damage to the CMOS wafer 100.

In one aspect, to protect the dielectric layer 104 from exposure to therelease chemical, a primary barrier layer 114 can be deposited to coverthe sidewalls 112. Moreover, the primary barrier layer 114 can compriseone or more metals that are resistant to the specific release chemical.For example, if Hydrofluoric acid (HF) is to be utilized as a releasechemical, metals, such as, but not limited to, Titanium, TitaniumNitride, Aluminum, or Aluminum-Copper, etc. that are resistant to HF canbe utilized. In an aspect, the primary barrier layer 114 can benon-brittle and/or flexible so that it does not crack, for example,under mechanical and/or thermal stresses that can be applied duringprocessing. Various processes can be utilized to deposit the primarybarrier layer 114, for example, but not limited to, sputtering,evaporation, plasma-enhanced chemical vapor deposition (PECVD), lowpressure chemical vapor deposition (CVD), atomic layer deposition, etc.The thickness of the primary barrier layer 114 can vary based on theproperties of the metal utilized and is typically thick enough not to beporous. For example, if the metal utilized slowly erodes when exposed tothe release chemical (e.g., the metal is not completely resistant to therelease chemical but has a slow etch rate), the thickness of the primarybarrier layer 114 should be sufficient to survive the release processand not completely erode. Generally, the thickness of the primarybarrier layer 114 can range from (but is not limited to) 100 angstrom to5 micron.

FIG. 2 illustrates an example CMOS wafer 200 comprising a passivationlayer 106 that is protected from exposure to a release chemical. In oneaspect, a secondary barrier layer 202 can be deposited on thepassivation layer 106 for protection from/resistance against a releasechemical (e.g., HF). It is noted that the substrate 102, dielectriclayer 104, passivation layer 106, metal pads 108, passivation openings(110 a, 110 b), and the primary barrier layer 114 can includefunctionality, as more fully described with respect to device 100.

In one aspect, the secondary barrier layer 202 is an insulating layerthat blankets over majority of the wafer 200. As an example, thesecondary barrier layer 202 can include, but is not limited to adielectric material that is resistant (or partially resistant) to therelease chemical. The secondary barrier layer 202 can have most any stepcoverage and is not required to be robust against cracking over thepassivation openings (110 a, 110 b). Thus, a wide variety of insulatingmaterials can be utilized. In one aspect, various processes can beutilized to deposit the secondary barrier layer 202, for example, butnot limited to, sputtering, evaporation, PECVD, low pressure CVD,enhanced CVD, atomic layer deposition, etc. The thickness of thesecondary barrier layer 202 can vary based on the properties of thedielectric utilized and is typically thick enough not to be porous. Forexample, if the dielectric utilized slowly erodes when exposed to therelease chemical (e.g., the dielectric is not completely resistant tothe release chemical but has a slow etch rate), the thickness of thesecondary barrier layer 202 can be made sufficient to survive therelease process and not completely erode. In one aspect, the secondarybarrier layer 202 is an optional layer. For example, the secondarybarrier layer 202 may not be used if the passivation layer 106 isresistant to the release chemical.

FIGS. 3A and 3B illustrate an example integrated CMOS-MEMS device duringdifferent stages of fabrication, according to an aspect of thespecification. In one aspect, CMOS-MEMS integration can improve theperformance of the MEMS structure 302 and allow for smaller packages,leading to lower packaging and/or instrumentation costs. MEMS processesutilize sacrificial layers 304 to produce fragile MEMS structures 302(e.g., movable structures) such as, but not limited to, thin membranesor low stiffness mechanical devices. Moreover, the sacrificial layers304 mechanically support such MEMS structures 302 during the fabricationprocess, after which the sacrificial layers 304 are released by using arelease chemical as a last step in the process. However, integratingsuch structures 302 with CMOS at wafer level is challenging since CMOSlayers cannot typically survive exposure to the release chemicals. Tointegrate the MEMS structures 302 with the CMOS layers, passivationopenings (110 a, 100 b) can be created to expose metals pads 108 thatcan be bonded to the MEMS structure 302 (e.g., via eutectic bonds). Thecreation of the passivation openings (110 a, 100 b) exposes thedielectric layer 104 of the CMOS (via the sidewalls). Moreover, therelease chemical can react with the dielectric layer 104 of the CMOS andcause substantial damage to the CMOS structure.

According to an aspect, to prevent exposure of the dielectric layer 104to the release chemical, the vulnerable passivation openings (110 a, 110b) can be covered (completely or partially) with the primary barrierlayer 114 (and optionally the vulnerable passivation layer 106 can becovered with the secondary barrier layer 202). Accordingly, theCMOS-MEMS device can be made robust to the MEMS release chemistryallowing fabrication of the integrated CMOS-MEMS device usingsacrificial oxide structures. It is noted that the substrate 102,dielectric layer 104, passivation layer 106, metal pads 108, passivationopenings (110 a, 110 b), the primary barrier layer 114, and secondarybarrier layer can include functionality, as more fully described withrespect to devices 100 and 200.

Referring now to FIG. 3A, there depicted is an example integratedCMOS-MEMS device 300 prior to the MEMS release process. As an example,the MEMS structure can comprise poly-Si or poly-SiGe and the sacrificiallayer 304 can comprise a silicon oxide layer (SiO₂). The sacrificiallayer 304 can be removed by exposing the integrated CMOS-MEMS device 300to a release chemical such as, but not limited to liquid HF and/or vaporHF (VHF). In one example, if a wet chemical etching process is to beperformed, mixture of liquid HF and water or a mixture of buffered HFwith glycerol can be utilized as the release chemical. Typically, whenthe released wet etched structures dry, stiction problems can arise thatare avoided if a dry chemical etching process is performed by utilizingVHF.

FIG. 3B depicts an example integrated CMOS-MEMS device 350 after theMEMS release process. Moreover, when the CMOS-MEMS device 300 is exposedto the release chemical, the sacrificial layer 304 is removed, leavingbehind the CMOS-MEMS device 350. In one aspect, the primary barrierlayer 114 protects the dielectric layer 104 and prevents exposure of thedielectric layer 104 to the release chemical through the sidewalls ofthe passivation openings (110 a, 110 b). Additionally (or optionally),the secondary barrier layer 202 protects the passivation layer 106 andprevents exposure of the passivation layer 106 to the release chemical.Accordingly, the release chemical does not damage the CMOS layers. It isnoted that the primary barrier layer 114 and the secondary barrier layer202 can be resistant to the release chemical and/or can react with therelease chemical with a slow etch rate. Moreover, the primary barrierlayer 114 can comprise most any metal resistant (e.g., partially orcompletely) to the release chemical while the secondary barrier layer202 can comprise most any dielectric material resistant (e.g., partiallyor completely) to the release chemical.

Referring now to FIGS. 4A and 4B, there illustrated is an example MEMSstructure integrated within a metallization stack of a CMOS device (400,450) during different stages of fabrication, according to an aspect ofthe specification. According to an aspect, the MEMS structure 402 can becreated from CMOS metal layers (or combination of metal and dielectriclayers) of a CMOS wafer. Typically, after CMOS wafer fabrication, theMEMS structure 402 can be released by exposing the CMOS device 400 toVHF passed through the release holes (404 a, 404 b) formed in thepassivation layer 106. It is noted that the substrate 102, dielectriclayer 104, passivation layer 106, metal pads 108, passivation openings(110 a, 110 b), and the primary barrier layer 114, can includefunctionality, as more fully described with respect to devices 100-350.Although not depicted in FIGS. 4A and 4B, the passivation layer 106 canbe covered with and protected by a secondary barrier layer (e.g.,secondary barrier layer 202).

In one example scenario, passivation openings (110 a, 110 b) can becreated after the release to the MEMS structure 402 to prevent exposureof the dielectric layer 104 through the sidewalls of the passivationopenings (110 a, 110 b). In this scenario, after the MEMS release, therelease holes (404 a, 404 b) are sealed by depositing another layer overthe release holes (404 a, 404 b) before the metal pads 108 can beexposed. However, if the MEMS structure 402 needs to be exposed to theenvironment (e.g., in the case of a pressure, chemical, and/or acousticsensors), the metal pads 108 cannot be opened after the release due tothe risk of damaging the MEMS structure 402 through the release holes(404 a, 404 b). Accordingly, to enable opening of metal pads 108 priorto the MEMS release, the primary barrier layer 114 can be deposited overat least a portion of the passivation openings (110 a, 110 b) such thatthe sidewalls that expose the dielectric layer 104 are covered by theprimary barrier layer 114. As an example, the primary barrier layer 114can comprise most any metal or combination of metals resistant (e.g.,partially or completely) to VHF.

FIG. 4A depicts an example MEMS structure 402 integrated within a CMOSdevice 400 prior to the MEMS release process. Release holes (404 a, 404b) are created within the passivation layer 106 and VHF is passedthrough the release holes (404 a, 404 b) to etch the MEMS structure 402.The dielectric layer 104 exposed through the sidewalls of thepassivation openings (110 a, 110 b) is protected from the VHF by theprimary barrier layer 114. FIG. 4B depicts an example MEMS structure 402integrated within a CMOS device 450 after the MEMS release process.Moreover, on exposure to the release chemical, the sacrificial material(e.g., portion of the dielectric layer 104) is removed, leaving behindthe released MEMS structure 402. Accordingly, the release chemical doesnot damage the CMOS layers. It is noted that the primary barrier layer114 (and/or the secondary barrier layer 202) can be resistant to therelease chemical and/or can react with the release chemical with a slowetch rate.

FIG. 5 illustrates an example system 500 utilized for sensing anacoustic signal in accordance with an aspect of the subject disclosure.System 500 depicts one example application of the integrated CMOS-MEMSdevice disclosed herein. However, it is noted that the subjectspecification is not limited to microphone/sensor applications andaspects disclosed herein can be utilized in various integrated circuitsutilized for different applications. In one aspect, system 500 can beutilized in various applications, such as, but not limited to,communication devices, medical applications, security systems, biometricsystems (e.g., fingerprint sensors and/or motion/gesture recognitionsensors), industrial automation systems, consumer electronic devices,robotics, etc. In one aspect, system 500 can include a sensing component502 that can facilitate acoustic sensing. Moreover, the sensingcomponent 502 can include a silicon wafer 504 having a two-dimensional(or one-dimensional) array 506 of acoustic sensors 508, for example,integrated CMOS-MEMS devices 350 and/or 450. As an example, the acousticsensor 508 can comprise thin MEMS membranes (302, 402) that aresupported by sacrificial layers (304, 104) during fabrication. At theend of the fabrication process, the sacrificial layers (304, 104) areremoved by exposure to a release chemical (e.g., HF, VHF). During theremoval process, the CMOS layers exposed through a sidewall of apassivation opening are protected by utilizing a primary barrier layer114 that covers the sidewall. Additionally or optionally, thepassivation layer 106 of the CMOS is protected from the release chemicalby utilizing a secondary barrier layer 202 that covers a top surface ofthe passivation layer 106.

The MEMS membrane (302, 402) vibrates based on the incoming acousticsignal and a change in capacitance due to the movement of the MEMSmembrane (302, 402) can be utilized to generate a correspondingelectrical signal. A processing component 510 can further process theelectrical signal. For example, the electrical signal can be digitizedand stored in a data store 512. In another example, the electricalsignal can be transmitted to another device and/or played back via aspeaker.

It is noted that the processing component 510 and/or the data store 512can be locally and/or remotely coupled to the sensing component 502 viamost any wired and/or wireless communication network. Further, it isnoted that the processing component 510 can include one or moreprocessors configured to confer at least in part the functionality ofsystem 500. To that end, the one or more processors can execute codeinstructions stored in memory, for example, volatile memory and/ornonvolatile memory. By way of illustration, and not limitation,nonvolatile memory can include read only memory (ROM), programmable ROM(PROM), electrically programmable ROM (EPROM), electrically erasablePROM (EEPROM), or flash memory. Volatile memory can include randomaccess memory (RAM), which acts as external cache memory. By way ofillustration and not limitation, RAM is available in many forms such asstatic RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), doubledata rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), Synchlink DRAM(SLDRAM), and direct Rambus RAM (DRRAM). The memory (e.g., data stores,databases) of the subject systems and methods is intended to comprise,without being limited to, these and any other suitable types of memory.

As it employed in the subject specification, the term “processor” canrefer to substantially any computing processing unit or devicecomprising, but not limited to comprising, single-core processors;single-processors with software multithread execution capability;multi-core processors; multi-core processors with software multithreadexecution capability; multi-core processors with hardware multithreadtechnology; parallel platforms; and parallel platforms with distributedshared memory. Additionally, a processor can refer to an integratedcircuit, an application specific integrated circuit (ASIC), a digitalsignal processor (DSP), a field programmable gate array (FPGA), aprogrammable logic controller (PLC), a complex programmable logic device(CPLD), a discrete gate or transistor logic, discrete hardwarecomponents, or any combination thereof designed to perform the functionsdescribed herein. Processors can exploit nano-scale architectures suchas, but not limited to, molecular and quantum-dot based transistors,switches and gates, in order to optimize space usage or enhanceperformance of user equipment. A processor may also be implemented as acombination of computing processing units.

It is noted that the design of devices 100-450 and/or system 500 caninclude different material selections, topologies, etc., to achieveefficient protection of CMOS layers during a release of a MEMS structureof an integrated CMOS-MEMS device. Moreover, it is noted that thedevices 100-450 and/or system 500 can include most any components andcircuitry elements of any suitable value in order to implement theembodiments of the subject innovation. Further, it is noted that thedevices 100-450 can include fewer or greater number of layers and/ordesigns for each layer. Furthermore, it can be appreciated that thecomponents of devices 100-450 and/or system 500 can be implemented onone or more integrated circuit (IC) chips.

FIGS. 6-7 illustrate methodologies and/or flow diagrams in accordancewith the disclosed subject matter. For simplicity of explanation, themethodologies are depicted and described as a series of acts. It is tobe understood and appreciated that the subject innovation is not limitedby the acts illustrated and/or by the order of acts, for example actscan occur in various orders and/or concurrently, and with other acts notpresented and described herein. Furthermore, not all illustrated actsmay be required to implement the methodologies in accordance with thedisclosed subject matter. In addition, the methodologies couldalternatively be represented as a series of interrelated states via astate diagram or events. Additionally, it should be further appreciatedthat the methodologies disclosed hereinafter and throughout thisspecification are capable of being stored on an article of manufactureto facilitate transporting and transferring such methodologies tocomputers. The term article of manufacture, as used herein, is intendedto encompass a computer program accessible from any computer-readabledevice or computer-readable storage/communications media.

FIG. 6 illustrates an example methodology 600 for depositing protectivelayers within an integrated CMOS-MEMS device in accordance with anaspect of the subject disclosure. Specifically, methodology 600 enablesrelease of a MEMS structure without damage to the CMOS wafer duringfabrication. At 602, an opening can be created within a passivationlayer of an integrated circuit substrate (e.g., CMOS wafer). As anexample, the passivation layer can comprises thin-film coatings (e.g.,of Silicon Nitride) that can be deposited on the layers of theintegrated circuit substrate during a passivation process (e.g., usingPECVD). The passivation layer protects the integrated circuit substratefrom moisture and/or external contamination, enables heat dissipation,increases wear resistance and/or increases electrical insulation. In oneaspect, the passivation opening can be created within the passivationlayer, for example, to expose a metal pad of the integrated circuitsubstrate during bonding to a MEMS device (e.g., via eutectic bonds,metal compression bonds, fusion bonds, anodic bonds, copper-to-copperbonds, etc.), to expose a probe pad, and/or to expose a wire-bond pad tofacilitate packaging, etc.

At 604, a metal layer can be deposited over a portion of the openingthough which a dielectric layer (e.g., oxide layer) of the integratedcircuit substrate has been exposed. For example, the metal layer can bedeposited over the entire opening and then patterned to leave the metallayer only over a sidewall (e.g., vertical façade) of the opening thatexposes the dielectric layer. Moreover, the metal layer can be depositedby various deposition processes, such as, but not limited to,sputtering, evaporation, atomic layer deposition, enhanced CVD, and/orlow pressure CVD, etc. In one aspect, the metal layer can comprise mostany metal or combination or metals that are non-brittle and/or flexibleto avoid cracking on the corners of the opening (e.g., under mechanicaland/or thermal stresses that can be applied during processing), such as,but not limited to, Aluminum, Aluminum-Copper, Titanium, and/or Titaniumnitride, etc. In addition, the metal or combination or metals can beresistant (or partially resistant) to a release chemical utilized torelease a MEMS structure integrated with the integrated circuitsubstrate.

At 606, a dielectric layer can be deposited on a surface of thepassivation layer. The dielectric layer can be an insulating layer thatcovers majority of the CMOS wafer to prohibit the release chemical fromreacting with the CMOS wafer. As an example, the dielectric layer caninclude most any dielectric material that is resistant (or partiallyresistant) to the release chemical. In one aspect, various processes canbe utilized to deposit the dielectric layer, for example, but notlimited to, sputtering, evaporation, PECVD, low pressure CVD, atomiclayer deposition, etc. According to an aspect, the thickness of themetal layer and/or the dielectric layer can vary based on the propertiesof the materials utilized and is typically thick enough not to beporous. For example, if the material utilized slowly erodes when exposedto the release chemical, the thickness of the metal layer and/or thedielectric layer is kept thick enough to survive the release process andnot completely erode. In one aspect, the dielectric layer is an optionallayer that can be utilized, for example, if the passivation layer is notresistant to the release chemical.

FIG. 7 illustrates an example methodology 700 for protecting adielectric layer of an integrated CMOS-MEMS device in accordance with anaspect of the subject disclosure. At 702, exposure of the dielectriclayer via a sidewall of a passivation opening of the integratedCMOS-MEMS device can be prevented by covering the sidewall with a metallayer. As an example, the metal layer can be deposited by variousdeposition processes, such as, but not limited to, sputtering,evaporation, atomic layer deposition, enhanced CVD, and/or low pressureCVD, etc. In one aspect, the metal layer can comprise most any metal orcombination or metals that are resistant (or partially resistant) to arelease chemical utilized to release a MEMS structure of the CMOS-MEMSdevice. As an example, the metal layer can comprise Aluminum,Aluminum-Copper, Titanium, and/or Titanium nitride, etc.

At 704, the MEMS structure can be released by exposing the CMOS-MEMSdevice to a release chemical (e.g., HF, VHF, etc.). The release chemicalremoves sacrificial layers, leaving behind a movable MEMS structure. Inone aspect, the metal layer protects the dielectric layer and preventsexposure of the dielectric layer to the release chemical through thesidewalls of the passivation openings. Accordingly, the release chemicaldoes not damage the CMOS layers.

What has been described above includes examples of the subjectdisclosure. It is, of course, not possible to describe every conceivablecombination of components or methodologies for purposes of describingthe subject matter, but it is to be appreciated that many furthercombinations and permutations of the subject disclosure are possible.Accordingly, the claimed subject matter is intended to embrace all suchalterations, modifications, and variations that fall within the spiritand scope of the appended claims.

In particular and in regard to the various functions performed by theabove described components, devices, systems and the like, the terms(including a reference to a “means”) used to describe such componentsare intended to correspond, unless otherwise indicated, to any componentwhich performs the specified function of the described component (e.g.,a functional equivalent), even though not structurally equivalent to thedisclosed structure, which performs the function in the hereinillustrated exemplary aspects of the claimed subject matter.

The aforementioned systems and/or components have been described withrespect to interaction between several components. It can be appreciatedthat such systems and/or components can include those components orspecified sub-components, some of the specified components orsub-components, and/or additional components, and according to variouspermutations and combinations of the foregoing. Sub-components can alsobe implemented as components communicatively coupled to other componentsrather than included within parent components (hierarchical).Additionally, it should be noted that one or more components may becombined into a single component providing aggregate functionality ordivided into several separate sub-components, and any one or more middlelayers, may be provided to communicatively couple to such sub-componentsin order to provide integrated functionality. Any components describedherein may also interact with one or more other components notspecifically described herein.

In addition, while a particular feature of the subject innovation mayhave been disclosed with respect to only one of several implementations,such feature may be combined with one or more other features of theother implementations as may be desired and advantageous for any givenor particular application. Furthermore, to the extent that the terms“includes,” “including,” “has,” “contains,” variants thereof, and othersimilar words are used in either the detailed description or the claims,these terms are intended to be inclusive in a manner similar to the term“comprising” as an open transition word without precluding anyadditional or other elements.

What is claimed is:
 1. A method, comprising: creating an opening in apassivation layer of a integrated circuit substrate, wherein a sidewallof the opening exposes a dielectric layer of the integrated circuitsubstrate; and depositing a barrier layer on the sidewall to protect thedielectric layer from a release chemical employable to release amicro-electro-mechanical (MEMS) device integrated with the integratedcircuit substrate, wherein the barrier layer comprises a metal.
 2. Themethod of claim 1, wherein the depositing comprises depositing the metalon the integrated circuit substrate and patterning the metal to leave aportion of the metal that forms the barrier layer on the sidewall. 3.The method of claim 2, wherein the depositing the metal comprisesdepositing at least one of Aluminum, Aluminum-Copper, Titanium, orTitanium Nitride.
 4. The method of claim 1, further comprising: exposingthe MEMS device integrated with the integrated circuit substrate to therelease chemical, wherein the exposing facilitates a removal of asacrificial layer of the MEMS device.
 5. The method of claim 4, whereinthe exposing comprises exposing the MEMS device to at least one ofvapor-phase hydrofluoric acid or liquid-phase hydrofluoric acid.
 6. Themethod of claim 1, wherein the creating the opening comprises exposing ametal pad of the integrated circuit substrate.
 7. The method of claim 6,further comprising: subsequent to the creating the opening, bonding theintegrated circuit substrate to the MEMS device via the metal pad. 8.The method of claim 7, wherein the boding comprises bonding theintegrated circuit substrate to the MEMS device via at least one of aneutectic bond, metal compression bond, fusion bond, anodic bond, orcopper-to-copper bond.
 9. The method of claim 1, wherein the depositingcomprises depositing the barrier layer based on at least one of asputtering, evaporation, atomic layer deposition, plasma enhancedchemical vapor deposition, or low pressure chemical vapor depositionprocess.
 10. The method of claim 1, wherein the barrier layer is a firstbarrier layer and the method further comprises: depositing a secondbarrier layer on a surface of the integrated circuit substrate toprotect the surface from the release chemical.
 11. The method of claim10, wherein the depositing the second barrier layer comprises depositingan insulating layer.
 12. The method of claim 10, wherein the depositingthe second barrier layer comprises depositing a dielectric material. 13.An integrated device, comprising: a complementarymetal-oxide-semiconductor (CMOS) wafer; and a micro-electro-mechanical(MEMS) device integrated with the CMOS wafer, wherein the MEMS devicecomprises sacrificial layer that is removable by utilization of arelease chemical, and wherein the CMOS wafer comprises a passivationlayer with an opening having a sidewall that exposes a dielectric layerof the CMOS wafer and a barrier material, comprising a metal resistantto the release chemical, that covers the sidewall.
 14. The integrateddevice of claim 13, wherein the barrier material is formed by depositingthe metal on the integrated circuit substrate and patterning the metalto leave a portion of the metal that forms the barrier layer on thesidewall.
 15. The integrated device of claim 14, wherein the depositingcomprises depositing the barrier material based on at least one of asputtering, evaporation, atomic layer deposition, plasma enhancedchemical vapor deposition, or low pressure chemical vapor depositionprocess.
 16. The integrated device of claim 13, wherein the metalcomprises at least one of Aluminum, Aluminum-Copper, Titanium, orTitanium Nitride.
 17. The integrated device of claim 13, wherein therelease chemical comprises at least one of vapor-phase hydrofluoric acidor liquid-phase hydrofluoric acid.
 18. The integrated device of claim13, wherein the barrier material is a first barrier material and whereina second barrier layer is deposited over at least a portion of the firstbarrier material.
 19. The integrated device of claim 18, wherein thesecond barrier material comprises an insulator.
 20. The integrateddevice of claim 18, wherein the second barrier material comprises adielectric material.